Qwin шарики для перебалловки BGA с покрытием свинца 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 мм паяльная паста для перепайки и ремонта ИС.

Qwin шарики для перебалловки BGA с покрытием свинца 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7 мм паяльная паста перепайки и ремонта ИС.

Qwin Leaded BGA Reballing Ball 250K 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55 0.6 0.65 0.7mm Solder Ball for IC Chip BGA Rework Repair

Features

Brand:QWIN
Balls Size:0.2/0.25/0.3/0.35mm
SGS Tested and Certified
QTY: 250K Pcs /Bottle

Dear Customer :

Thank you very much for your visiting our store!Our product
100% from orgainal factory
if you have any questions,Please feel free to contact with us,
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About Shipping:

1.We can send out quickly since we have inventory,Normally we can send out your product in 2 working days

2.For some country, the shipping cost maybe very high, you can buy in bulk so save you some shipping

3.If we found your place in remote area in logistic system, we will check with you to find a best way to save your cost

4.Please kindly note our product price are not including the custom duties and remote delivery costs.if you have any requirement, please contact me before shipping.

After-sales Policy：

If the product does not match the description, we will 100% refund,
please ensure the product in original status
We will provide video technical support, Online support if you need

WeTradeTek a professional team for phone repair tools, accessories,machine etc.we have been this field for more than 5 years,

if you have any other questions, welcome for inquiry , hope you have a joyful shopping !